3D time-of-flight sensing

High-precision 3D ToF Camera Modules, Sensors & VCSELs

We help you integrate 3D depth sensing into robotics and smart devices, with calibration and engineering support from evaluation to production.

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DOMI compact time-of-flight depth sensor module

DOMI engineering proof points

2016
Founded in Shenzhen
Emitter to camera
One connected sensing stack
Lab to line
Calibration and production support
Design to scale
From evaluation to volume delivery

Full-Stack 3D Time-of-Flight Capabilities: From VCSEL to Production

DOMI connects the optical, electronic, algorithm, and manufacturing decisions that determine whether a depth system works outside the lab.

  1. Emitter and optics

    VCSEL options, optical design, and eye-safety considerations for the target environment.

  2. Sensors and modules

    Sensor, driver, electronics, and mechanical choices shaped around your device constraints.

  3. Depth and calibration

    Depth algorithms, calibration, SDK support, and data output for the host system.

  4. Testing and production

    Reliability planning, production test thinking, and a path from sample to scale.

High-Precision 3D ToF Hardware: Sensors, Modules & Depth Cameras

Start with the development stage and output you already understand. The product path can then narrow around range, field of view, interface, and host platform.

DMAS2M001 8 m SPAD dToF array module front view with receive lens and 940 nm VCSEL DMAS2M001 DMAS2M001 is a compact SPAD dToF array module with USB-C/FPC connections and depth, point-cloud and confidence outputs for robot and UAV sensing. Resolution 40 × 30 at 10 fps Range 0.2-8 m @ 30 klux Field of View 60° H × 45° V View product DMOM2508CL 320×240 ToF depth camera with MIPI CSI-2 interface and flexible ribbon cable DMOM2508CL DMOM2508CL provides QVGA ToF depth data through two-lane MIPI CSI-2 for near-field gesture interaction and embedded spatial sensing. Depth Resolution 320 × 240 Measurement Range 0.2-2 m Frame Rate 10-30 fps View product

SOLUTIONS BY MARKET

3D ToF Vision Solutions for Autonomous Systems & Smart Devices

One unified 3D depth platform powering robotics, smart logistics, and intelligent spaces. Explore dedicated optical architectures, real-world scene constraints, and hardware paths.

DOMI optical sensor production line in a cleanroom Validation and production support

ENGINEERING TO PRODUCTION

Engineering to Production: From Optical Calibration to Scaled Delivery

Bring the target specification, host platform, and real scene conditions. DOMI helps connect the first architecture to a validated depth path and a practical delivery plan.

  1. Define

    Range, FOV, target, environment, and interface.

  2. Prototype

    Samples, SDK access, and a working data path.

  3. Validate

    Calibration and tests with real materials and motion.

  4. Scale

    Reliability, production tests, and delivery planning.

Blog & insights

Technical Insights & 3D ToF Engineering Resources

Read practical notes on product selection, depth data, and application design.

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Ready to Integrate 3D Depth? Tell Us What Your Device Needs to See

Share the distance, target, field of view, environment, host platform, and expected production path.

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